SAMSUNG Electronics Co., Ltd. announced today that its advanced DDR2 memory solutions are ready to meet the needs of a new generation of high performance PCs and servers. SAMSUNG’s DDR2 solutions include 1Gb/512Mb/256Mb densities in 400/533/667Megabits per second (Mbps) performance and nineteen DDR2 based module combinations.
SAMSUNG has passed Intel system validation for twelve of its 512Mb and 256Mb DDR2 components, the largest volume in the industry. Based on its full line up of quality components, SAMSUNG provides a broad availability of module configurations including a high density 2GByte Registered-DIMM utilizing SAMSUNG’s unique module design technology mounting thirty-six 512Mb monolithic devices in two rows on each face of the PCB and the industry’s highest performance 1Gbyte Unbuffered-DIMM made up of sixteen 512Mb DDR2-667 components.
SAMSUNG is transferring 0.10um 1Gb DDR2 production to its advanced 300mm line, no.12. Utilizing advanced production facilities and securing a broad range of DDR2 solutions SAMSUNG is ready to support the industry transition to new technologies this year.
According to market research firm Gartner Dataquest, the global DDR2 market is forecast to grow from approximately 10 percent of total DRAM sales this year to 66 percent by 2006. SAMSUNG will boost production of DDR2 for the seamless introduction of the next generation technology.
SAMSUNG plans to further expand its DRAM business that maintained over 30 percent market share in 2003 through its differentiation strategy targeting high value-added markets such as graphics, digital consumer and mobile applications.
