Fujitsu Launches the World’s First Low-Power Memory With 125 Degree C Specification for System-in-Package Products

    Fujitsu Microelectronics America, Inc.
    (FMA) introduced two consumer FCRAM memory ICs with the world’s first
    operating temperature range extended to 125 degree C with DDR SDRAM
    interfaces. The new, low-power memory ICs are optimized for use in
    System-in-Packages (SiP) in consumer products such as digital TVs and digital
    video cameras.

    “Customers using the new FCRAM ICs combined with a System-on-Chip (SoC)
    in the SiP configuration will achieve optimal performance even as the
    temperature of the SiP rises with the increase in operating speed,” said Tong
    Swan Pang, senior marketing manager, Fujitsu Microelectronics. “Today’s
    digital consumer products continue to demand higher performance, higher speeds
    and lower costs. SiPs that combine a memory chip with the SoC meet these
    requirements, and reduce the number of components and board space, helping
    lower system costs. Where rapid and flexible design is a key factor for
    success in the consumer electronics market, SiPs integrate high-speed memory
    and simplify design,” he added.

    Conventional memory has limited SiP usage because power consumption
    drives up temperatures. For example, a high-performance SoC can operate up to
    a maximum of 125 degree C, but the SiP becomes inoperable at much lower
    temperatures because memory has a lower temperature tolerance. One way to make
    SiPs viable with conventional memory is to add a heat disperser such as a heat
    sink to reduce temperatures to within operational range. But this solution
    increases both cost and footprint.

    The Fujitsu 512Mbit and 256Mbit consumer FCRAM ICs feature a maximum
    operating temperature of 125 degree C. Using the new FCRAMs, the SiP operates
    to specification even when it is used with a SoC featuring high power
    consumption – with no need to add a heat sink. (See Illustration of SiP with
    conventional memory compared with the SiP with a 125 degree C-rated

    The new FCRAMs also can provide data-transfer rates more than twice the
    rate of the conventional DDR SDRAM memory, while keeping power consumption
    low. The 512Mbit FCRAM can reduce power consumption by up to 50 percent
    compared to the equivalent conventional DDR2 SDRAM memory. As result, these
    FCRAMs contribute to a 50 percent reduction of CO2 emissions that typically
    emanate from the memory in digital consumer products.

    Fujitsu Microelectronics will continue to develop products with the
    necessary performance and functionality for SiPs to provide solutions with
    optimal value and cost for digital consumer products.

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