Fujitsu Microelectronics America, Inc.
(FMA) introduced two consumer FCRAM memory ICs with the world’s first
operating temperature range extended to 125 degree C with DDR SDRAM
interfaces. The new, low-power memory ICs are optimized for use in
System-in-Packages (SiP) in consumer products such as digital TVs and digital
video cameras.
“Customers using the new FCRAM ICs combined with a System-on-Chip (SoC)
in the SiP configuration will achieve optimal performance even as the
temperature of the SiP rises with the increase in operating speed,” said Tong
Swan Pang, senior marketing manager, Fujitsu Microelectronics. “Today’s
digital consumer products continue to demand higher performance, higher speeds
and lower costs. SiPs that combine a memory chip with the SoC meet these
requirements, and reduce the number of components and board space, helping
lower system costs. Where rapid and flexible design is a key factor for
success in the consumer electronics market, SiPs integrate high-speed memory
and simplify design,” he added.
Conventional memory has limited SiP usage because power consumption
drives up temperatures. For example, a high-performance SoC can operate up to
a maximum of 125 degree C, but the SiP becomes inoperable at much lower
temperatures because memory has a lower temperature tolerance. One way to make
SiPs viable with conventional memory is to add a heat disperser such as a heat
sink to reduce temperatures to within operational range. But this solution
increases both cost and footprint.
The Fujitsu 512Mbit and 256Mbit consumer FCRAM ICs feature a maximum
operating temperature of 125 degree C. Using the new FCRAMs, the SiP operates
to specification even when it is used with a SoC featuring high power
consumption – with no need to add a heat sink. (See Illustration of SiP with
conventional memory compared with the SiP with a 125 degree C-rated
The new FCRAMs also can provide data-transfer rates more than twice the
rate of the conventional DDR SDRAM memory, while keeping power consumption
low. The 512Mbit FCRAM can reduce power consumption by up to 50 percent
compared to the equivalent conventional DDR2 SDRAM memory. As result, these
FCRAMs contribute to a 50 percent reduction of CO2 emissions that typically
emanate from the memory in digital consumer products.
Fujitsu Microelectronics will continue to develop products with the
necessary performance and functionality for SiPs to provide solutions with
optimal value and cost for digital consumer products.
